Lead frames
As the chip carrier of the integrated circuit, the lead frame is a key structural member that realizes the electrical connection between the terminal of the internal circuit of the chip and the outer lead by means of bonding materials (gold wire, aluminum wire, copper wire) to form an electrical circuit. When it comes to connecting with external wires, lead frames are required in most semiconductor integrated blocks, which are important basic materials in the electronic information industry.
One of the best processes for producing leadframes is chemical etching. The raw materials used in the lead frame are: KFC, C194, C7025, FeNi42, TAMAC-15, PMC-90, etc. The selection of materials is mainly based on the strength, electrical conductivity and thermal conductivity required by the product.
Material
Copper and copper alloys
Nickel and nickel alloys
Full material stock list
Advantages of lead frames etching
Prototype to production - fast
Low cost fast design, unlimited complexity - fast
Burr-free and stress-free - metal properties are not affected
Delivery times are measured in days, not months - fast
Suitable for all steel grades
Accuracy is ±0.015mm