
Core Definition & Principle
Substrate: Thin, flexible rolls (Cu, stainless steel, Al, nickel alloys, PI film; 0.02–2 mm typical)
Process: Unwind → clean → coat photoresist → expose/develop → etch → rinse → strip resist → dry → rewind
Etch mode: Usually wet chemical spray/immersion (isotropic) for metals; can also do R2R plasma etching for polymers/oxides
Full Process Flow (Inline)
Unwind & web handling: Tension-controlled feeding of the coil
Cleaning: Degrease, oxide removal (acid/alkaline baths)
Photoresist coating: Roll-to-roll lamination or spray of dry/wet film resist
Exposure & development: UV exposure (contact/laser) + developer to open etch windows
Etching: Spray/immersion in etchant (e.g., FeCl₃ for steel, HNO₃ for Cu)
Rinsing & neutralization: Stop etch, remove residual chemicals
Resist stripping: Remove remaining maskant
Drying & inspection: Inline quality check
Rewind: Collect finished patterned web